Jorjin佐臻股份有限公司成立于1997年，是一家模块化处理、传感与无线连接解决方案供应商，公司有能力帮助所有客户在最短的时间内以有竞争力的价格将创新产品推向市场。Jorjin佐臻的客户涉及广泛的市场领域，包括可穿戴电子消费品、汽车信息娱乐、云连接设备和工业移动计算。 

Jorjin佐臻的无线系统级封装模块包括整个范围的协议，包括无线网、蓝牙/低功耗蓝牙、Zigbee、WiSun、近距离无线通讯技术（NFC）、全球定位系统和全球卫星导航系统。除了提供硬件外，Jorjin佐臻还为更广泛的应用处理器提供驱动程序移植服务。Jorjin佐臻还提供微控制单元连接解决方案，以支持新兴的物联网。另外，Jorjin佐臻还与领先的IC廠合作，到目前为止已经提供了8千万个系统级封装模块。

2012年，Jorjin佐臻推出了系列处理器系统模块解决方案，利用封装体叠层(PoP) 存储器或多芯片模块（MCM）总成实现各种高级功能且占有较小的空间。软件支持是通过核心板级支持包完成，Jorjin佐臻还提供联合设计与制造服务，根据这些模块提供完整的解决方案。目前市场上的产品包括移动销售点和票务、坚固型平板电脑、医疗器械和智能眼镜。

Jorjin佐臻近期还成立了一个新成像技术团队，负责设计并提供一系列相机传感器模块、飞行时间法三维成像相机和其他传感器解决方案，旨在增强并推动智能眼镜在各种行业的应用。

Founded in 1997, Jorjin Technologies is a provider of modular processing, sensing and wireless connectivity solutions which enable our customers to bring innovate products to market in the shortest possible time and at competitive cost. Our customers are in a wide range of markets including wearable consumer electronics, automotive infotainment, cloud connected devices and industrial mobile computing. 

Jorjin wireless system in package (SiP) modules cover the complete range of protocols including WiFi, Bluetooth / BLE, Zigbee, WiSun, NFC, GPS & GLONASS. In addition to supplying hardware, Jorjin offers driver porting services onto a wide range of application processors. We also provide MCU based connectivity solutions to support the emerging internet of things (IoT) market. We work with the leading silicon vendors and have shipped over 80M SiP modules to date.

In 2012, Jorjin launched the first in a series of application processor system on module (SoM) solutions. These advanced feature extremely small footprints using either package on package (PoP) memory or multi-chip module (MCM) assembly. Software support is via a core board support package (BSP) and Jorjin offers a joint design and manufacturing service to provide complete solutions based on these modules. Products currently on the market include mobile point of sale & ticketing, rugged tablets, medical devices and smart glasses. 

Jorjin recently also set up a new imaging team to design and supply a range of camera sensor modules, 3D time of flight cameras and other sensor solutions to build up and promote Smart Glass for various industries applications.